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SEMI 3D & Systems Summit Opens – Highlights Advanced Packaging for Emerging Technologies

DRESDEN, Germany — 27 January, 2020 — The SEMI 3D & Systems Summit opens today in Dresden, Germany, with top experts in 3D integration and systems for semiconductor manufacturing applications providing the year’s first comprehensive outlook for advanced packaging and systems. Themed Expanding Application Space, the annual three-day summit features the latest developments and insights in artificial intelligence (AI), 5G, heterogeneous integration, 3D roadmap and System-In-Package (SiP) technologies.

With automotive expected to rank among the strongest growth markets for semiconductors and advanced packaging in the coming decades, opening keynote speaker, Jan Vardaman, president and founder of TechSearch International Inc., will highlight packaging types essential for AI chips in automotive. Vardaman will also explore AI’s vital role in emerging healthcare, mobile, fintech and smart home technologies.

“The SEMI 3D & Systems Summit highlights Europe’s prowess in developing the advanced packaging and manufacturing systems key to the rapid adoption of 5G, AI, AR/VR, quantum computing and other leading-edge technologies,” said Laith Altimime, president, SEMI Europe. “The ‘20s promise astonishing innovations as the semiconductor industry drives to make a smarter world a reality.”

According to a recent Yole Développement report, advanced packaging has entered an era of great promise fueled by the critical need for improvements in chip component integration in order for 5G, AI, IoT, Industrial Internet of Things (IIoT), and high-performance computing (HPC) to flourish. Emilie Jolivet, Semiconductor and Software Division Director at Yole Développement, will discuss how heterogeneous integration will enable new HPC applications.

With wafer-level packaging (WLP), 3D stacking and SiP key to meeting the stringent form factor, high-speed and power consumption requirements for mobile devices, Romain Freux, CEO of System Plus Consulting, will explore the latest advanced packaging trends for mobile computing.

The 3D & Systems Summit offers business-to-business matchmaking, networking for participants to explore new partnerships, an exhibition, and a gala dinner. Visit 3D & Systems Summit for more information.

Follow #3DSummit @SEMIEurope on LinkedIn and Twitter.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe

Phone: +49 30 3030 8077-11

Email: sbrischetto@semi.org